K-PRO Advanced Packaging Resist

K-PRO is a advanced packaging positive photoresist for use in i-line, g-line and broadband packaging applications.

It offers high sensitivity, high throughput, and excellent process latitude.

  • Cover 5 – 25 µm in a single coat

  • Designed for use with metal-ion or metal-ion free developers

  • No PEB required

 
  25 um film, 10 um S/L

25 um film, 10 um S/L

  15 um film, 7 um S/L

15 um film, 7 um S/L

  Copper Plating Application: 5 um Cu Posts

Copper Plating Application: 5 um Cu Posts