KL 5300 Positive Photoresist
KL5300 series are positive photoresists for use in i-Line, g-Line and broadband applications.
KL5300 offers high sensitivity, high resolution and excellent process latitude.
Cover 0 – 2.5 µm in a single coat
Designed for use with industry standard 0.26 N TMAH developers
Achieve resolution 0.55 µm
Custom formulations available
Soft Bake: 105°C for 60 s
Expose: i-line, g-line, broadband
Post Expose Bake: 115°C for 60 s
Develop: spray, puddle or immersion
Developer: 0.26N TMAH
KL5302 Hi-Res Thin
Designed for film thickness of ~200 nm
Applied in interference or holographic lithography
Applied in broadband exposure tools or steppers