KL5300 Positive Photoresist

KL5300 series are positive photoresists for use in i-Line, g-Line and broadband applications.

KL5300 offers high sensitivity, high resolution and excellent process latitude.

  • Cover 0 – 2.5 µm in a single coat
  • Designed for use with industry standard 0.26 N TMAH developers
  • Achieve resolution 0.55 µm
  • Custom formulations available

Typical Process

  • Soft Bake: 105°C for 60 s
  • Expose: i-line, g-line, broadband
  • Post Expose Bake: 115°C for 60 s
  • Develop: spray, puddle or immersion                 
  • Developer: 0.26N TMAH

KL5302: Designed for thin film application

  • Designed for film thickness of ~200 nm
  • Applied in interference or holographic lithography
  • Applied in broadband exposure tools or steppers