KL 5300 Positive Photoresist

KL5300 series are positive photoresists for use in i-Line, g-Line and broadband applications.

KL5300 offers high sensitivity, high resolution and excellent process latitude.

  • Cover 0 – 2.5 µm in a single coat

  • Designed for use with industry standard 0.26 N TMAH developers

  • Achieve resolution 0.55 µm

  • Custom formulations available

Typical Process

  • Soft Bake: 105°C for 60 s

  • Expose: i-line, g-line, broadband

  • Post Expose Bake: 115°C for 60 s

  • Develop: spray, puddle or immersion                 

  • Developer: 0.26N TMAH


KL5302 Hi-Res Thin

  • Designed for film thickness of ~200 nm

  • Applied in interference or holographic lithography

  • Applied in broadband exposure tools or steppers