KL6000 Positive Photoresist

KL6000 series are positive photoresists for use in i-Line, g-Line and broadband applications. KL6000 offers high sensitivity, high throughput, and excellent process latitude.

  • Cover 2.5 – 12 µm in a single coat
  • Designed for use with industry standard 0.26 N TMAH developers
  • No PEB necessary
  • Custom formulations available
 

 

Typical Process

  • Soft Bake: 105°C (90s - 150s)
  • Expose: i-line, g-line, broadband
  • Post Expose Bake: not neccessary
  • Develop: spray, puddle or immersion                 
  • Developer: 0.26N TMAH