KL6000 Positive Photoresist

KL6000 series are positive photoresists for use in i-Line, g-Line and broadband applications. KL6000 offers high sensitivity, high throughput, and excellent process latitude.

  • Cover 2.5 – 12 µm in a single coat

  • Designed for use with industry standard 0.26 N TMAH developers

  • No PEB necessary

  • Custom formulations available



Typical Process

  • Soft Bake: 105°C (90s - 150s)

  • Expose: i-line, g-line, broadband

  • Post Expose Bake: not necessary

  • Develop: spray, puddle or immersion

  • Developer: 0.26N TMAH