May 6-10, 2018
VISIT US AT BOOTH 101 WITH CAPITOL SCIENTIFIC
Learn the latest advances on compound semiconductor manufacturing technology at CS MANTECH 2018 - 33rd annual International Conference on Compound Semiconductor Manufacturing Technology (CS MANTECH)
Kemlab has a new release - KL P4800. It is a thick positive packaging resist designed for bumping and metal plating application in advanced packaging field. KL P4800 can cover the film thickness up to 40 um and is compatible with either metal ion or metal ion free developers. Click here for datasheet.
Contact us for more information about this new products if any interests.